WaferWire LLC — H1B Data for FY2018
FY2018 H1B Overview for WaferWire LLC
In fiscal year 2018, WaferWire LLC filed 1 H1B labor condition applications with the U.S. Department of Labor. Of these, 0 were certified and 0 were denied. The average salary offered on these applications was $113,000.
The applications covered a total of 1 worker positions, as a single LCA can cover multiple workers in the same role and location.
According to USCIS data, WaferWire LLC had 0 initial H1B petitions approved and 5 denied in FY2018, resulting in an approval rate of 0.0%. The H1B approval process involves both DOL labor condition certification and USCIS petition adjudication.
View WaferWire LLC's complete sponsorship history on the full employer profile, including all years, job titles, and salary trends. Learn more about the H1B visa program in our comprehensive H1B visa guide.
FY2018 H1B Filings by WaferWire LLC
Individual labor condition applications filed by WaferWire LLC in fiscal year 2018. There are 1 filings total.
| Case # | Status | Job Title | Salary | Location | Date |
|---|---|---|---|---|---|
| I-200-18117-133883 | Certified | SOFTWARE DEVELOPMENT ENGINEER | $113,000 | REDMOND, WA | 2018-05-03 |
WaferWire LLC H1B History by Year
Browse WaferWire LLC's H1B filing data for other fiscal years.