Materials Engineers at Micron Technology, Inc. — H1B Salary Data
Salary Analysis: Materials Engineers at Micron Technology, Inc.
Micron Technology, Inc. has filed 305 H1B labor condition applications for Materials Engineers (SOC 17-2131) positions. The average salary offered on these applications is $95,940, with salaries ranging from $63,000 to $173,779.
Compared to the BLS national median salary of $111,680 for Materials Engineers, Micron Technology, Inc.'s H1B salary offers are -14.1% Below Market. This comparison helps assess whether the employer's compensation is competitive with the broader market rate for this occupation. The prevailing wage for this role is a key factor in H1B salary determinations.
The average prevailing wage on these applications is $75,111, which represents the Department of Labor's benchmark for this occupation and work location. Understanding the relationship between offered salary and prevailing wage is critical for H1B compliance.
Nationally, Materials Engineers positions have 11,112 total H1B filings with an average salary of $90,131. Micron Technology, Inc. is one of multiple employers sponsoring H1B workers for this role. View the H1B visa guide for details on sponsorship eligibility and the approval process.
Salary Comparison: Micron Technology, Inc. vs BLS National Data
How does Micron Technology, Inc.'s H1B salary for Materials Engineers compare to the Bureau of Labor Statistics national wage distribution? This table shows the employer's offered salary alongside BLS benchmarks.
| Metric | Employer (H1B) | BLS National |
|---|---|---|
| Average / Mean | $95,940 | $126,600 |
| Minimum / 10th Percentile | $63,000 | $100,650 |
| Maximum / 90th Percentile | $173,779 | $164,660 |
| Median | — | $111,680 |
BLS data represents national salary distribution for Materials Engineers across all industries. Total national employment: 70 workers. Source: Bureau of Labor Statistics, Occupational Employment and Wage Statistics.
Recent H1B Filings: Materials Engineers at Micron Technology, Inc.
The following table shows recent labor condition applications filed by Micron Technology, Inc. for Materials Engineers positions. There are 338 filings total.
| Case # | Status | Job Title | Salary | Location | Date |
|---|---|---|---|---|---|
| I-200-25315-397172 | Certified | Sr. Engineer - DRAM PI | $135,742 | Boise, ID | 2025-11-18 |
| I-200-25265-325864 | Certified | YT Equipment Program Manager | $118,000 | Boise, ID | 2025-09-29 |
| I-200-25182-144196 | Certified | Thin Films Process Development Engineer | $131,197 | Boise, ID | 2025-07-09 |
| I-200-25175-124647 | Certified | CMP Process Development Engineer | $103,851 | Boise, ID | 2025-07-01 |
| I-200-24267-357356 | Certified | DRAM Principal Process Integration Engineer | $155,000 | Boise, ID | 2024-09-30 |
| I-200-24248-313496 | Certified | R&D Thin Film Process Development Engineer | $114,240 | Boise, ID | 2024-09-11 |
| I-200-24243-306135 | Certified | Wet Process Development Engineer | $115,000 | Boise, ID | 2024-09-09 |
| I-200-24226-263351 | Certified | Semiconductor Process Engineer | $115,140 | Boise, ID | 2024-08-20 |
| I-200-24221-255280 | Certified | WorkForce Development Specialist | $106,575 | Boise, ID | 2024-08-15 |
| I-200-24221-254053 | Certified | Principal Engineer-CVD/DIFF DRAM/EM | $145,600 | Boise, ID | 2024-08-15 |
| I-200-24207-222444 | Certified | Semiconductor Process Engineer | $118,000 | Boise, ID | 2024-08-01 |
| I-200-24197-195557 | Certified | R&D Dry Etch Process Development Engineer | $126,499 | Boise, ID | 2024-07-22 |
| I-200-24197-195981 | Certified | Sr. Manager, Dry Etch - NVM | $173,779 | Boise, ID | 2024-07-22 |
| I-200-24179-154345 | Certified | Photolithography Process Development Engineer | $93,730 | Boise, ID | 2024-07-05 |
| I-200-23261-355742 | Certified | Photolithography Process Development Engineer | $91,000 | Boise, ID | 2023-09-25 |
| I-200-23256-342078 | Certified | Engineer NVE PE | $115,000 | Boise, ID | 2023-09-20 |
| I-200-23256-342021 | Certified | PI DRAM ENG | $115,000 | Boise, ID | 2023-09-20 |
| I-200-23248-320543 | Certified | Engineer-DF-DRAM | $110,000 | Boise, ID | 2023-09-12 |
| I-200-23237-297526 | Certified | Process Engineer | $91,738 | Manassas, VA | 2023-09-01 |
| I-200-23230-277319 | Certified | Engineer-Dry Etch | $111,000 | Boise, ID | 2023-08-25 |
| I-200-23103-929496 | Certified | Business Title Engineer - Wet Process, DRAM/EM | $115,000 | Boise, ID | 2023-07-18 |
| I-200-22266-490407 | Certified | OCT Manufacturing Alignment Engineer | $131,612 | Manassas, VA | 2022-09-30 |
| I-200-21182-440550 | Certified | Engineer - Wet Process | $93,600 | BOISE, ID | 2021-07-09 |
| I-200-20254-815732 | Certified | Enigneer - Dry Etch Process | $101,500 | Boise, ID | 2020-09-17 |
| I-200-20239-789649 | Certified | Photo Process Engineering lead | $115,120 | Manassas, VA | 2020-09-02 |
| I-200-20189-699906 | Certified | R&D Wet Process Development Engineer | $119,462 | Boise, ID | 2020-07-14 |
| I-200-19163-421399 | Certified | PROCESS DEVELOPMENT ENGINEER - DRY ETCH DRAM/EM | $122,224 | Boise, ID | 2019-06-24 |
| I-200-19161-075690 | Certified | PHOTOLITHOGRAPHY ENGINEER | $97,968 | Manassas, VA | 2019-06-21 |
| I-200-19136-064696 | Certified | R&D DRY ETCH DEVELOPMENT ENGINEER | $105,000 | BOISE, ID | 2019-05-31 |
| I-200-19128-142231 | Certified | R&D THIN FILMS MATERIALS TECHNOLOGY ENGINEER | $106,348 | Boise, ID | 2019-05-14 |
| I-200-19112-426359 | Certified | CHEMICAL MECHANICAL PLANARIZATION (CMP) PROCESS ENGINEER | $93,624 | Boise, ID | 2019-05-09 |
| I-200-19116-272863 | Certified | SENIOR PROCESS ENGINEER | $136,000 | Manassas, VA | 2019-05-03 |
| I-200-19100-627640 | Certified | SENIOR ENGINEER-PHOTO PROCESS | $111,415 | BOISE, ID | 2019-05-03 |
| I-200-19072-341428 | Certified | ENGINEER CHEMICAL MECHANICAL PLANARIZATION (CMP) DRAM/EM | $98,000 | Boise, ID | 2019-04-10 |
| I-200-19086-535937 | Certified | FEMQA ENGINEER | $109,000 | Manassas, VA | 2019-04-09 |
| I-200-19084-456340 | Certified | PCE FAULT DETECTION ENGINEER | $100,000 | BOISE, ID | 2019-04-01 |
| I-200-19078-046630 | Certified | ENGINEER - DRY ETCH DRAM/EM | $95,000 | BOISE, ID | 2019-03-25 |
| I-200-19074-072552 | Certified | LEAD - CMP - DRAM/EM (PROCESS DEVELOPMENT) | $143,563 | BOISE, ID | 2019-03-22 |
| I-200-19073-049066 | Certified | ENGINEER - CMP - NVM | $104,312 | BOISE, ID | 2019-03-21 |
| I-200-19067-241642 | Certified | NAND PROCESS INTEGRATION ENGINEER | $100,000 | Boise, ID | 2019-03-15 |
| I-200-19067-242839 | Certified | PRINCIPAL ENGINEER-DRAM PROCESS INTEGRATION | $139,050 | Boise, ID | 2019-03-15 |
| I-200-19065-630346 | Certified | ENGINEER-NVM-CHEMICAL MECHANICAL PLANARIZATION (CMP) | $95,000 | Boise, ID | 2019-03-15 |
| I-200-19067-392059 | Certified | R&D DRY ETCH PROCESS DEVELOPMENT ENGINEER | $100,000 | BOISE, ID | 2019-03-15 |
| I-200-19067-192860 | Certified | ENGINEER-DRY ETCH PROCESS | $100,000 | BOISE, ID | 2019-03-15 |
| I-200-19065-316554 | Certified | ENGINEER-DRY ETCH-DRAM/EM | $97,000 | Boise, ID | 2019-03-12 |
| I-200-19063-181990 | Certified | THIN FILM PROCESS DEVELOPMENT ENGINEER | $98,000 | BOISE, ID | 2019-03-12 |
| I-200-19057-182874 | Certified | ENGINEER - CVD/DIFFUSION - DRAM/EM | $97,000 | BOISE, ID | 2019-03-12 |
| I-200-19059-396061 | Certified | R&D THIN FILMS MATERIALS TECHNOLOGY ENGINEER | $106,348 | Boise, ID | 2019-03-11 |
| I-200-19043-415253 | Certified | SENIOR PRODUCT YIELD ANALYSIS ENGINEER | $108,570 | BOISE, ID | 2019-03-09 |
| I-200-19040-600693 | Certified | SENIOR ENGINEER - TD | $112,759 | BOISE, ID | 2019-03-07 |
Other Positions at Micron Technology, Inc.
Besides Materials Engineers, Micron Technology, Inc. sponsors H1B workers for these occupations.
| Job Title | LCAs | Avg Salary | Market Median | vs Market |
|---|---|---|---|---|
| Electronics Engineers, Except Computer | 1,136 | $105,418 | $108,400 | -2.8% At Market |
| Electrical Engineers | 754 | $98,307 | $69,790 | +40.9% Above Market |
| Validation Engineers | 329 | $90,179 | $92,370 | -2.4% At Market |
| Chemical Engineers | 162 | $88,368 | $94,920 | -6.9% Below Market |
| Software Developers, Applications | 141 | $101,973 | N/A | N/A |
Other Employers Hiring Materials Engineers
These employers also sponsor H1B workers for Materials Engineers positions. Compare salary offers across different companies.
| Employer | State | LCAs | Avg Salary | Market Median | vs Market |
|---|---|---|---|---|---|
| Intel Corporation | MA | 824 | $104,880 | $111,680 | -6.1% Below Market |
| GlobalFoundries U.S.; Inc. | NY | 570 | $79,580 | $111,680 | -28.7% Below Market |
| Lam Research Corporation | CA | 473 | $112,065 | $111,680 | +0.3% At Market |
| Applied Materials, Inc. | CA | 381 | $107,816 | $111,680 | -3.5% At Market |
| The Dow Chemical Company | MI | 195 | $96,571 | $111,680 | -13.5% Below Market |