Materials Engineers at Micron Technology, Inc. — H1B Salary Data — Page 3
Recent H1B Filings: Materials Engineers at Micron Technology, Inc. — Page 3
The following table shows recent labor condition applications filed by Micron Technology, Inc. for Materials Engineers positions. There are 338 filings total.
| Case # | Status | Job Title | Salary | Location | Date |
|---|---|---|---|---|---|
| I-200-18057-888749 | Certified | ENGINEER - PHOTO - NVM | $85,000 | BOISE, ID | 2018-03-08 |
| I-200-18057-294129 | Certified | THIN FILM PROCESS DEVELOPMENT ENGINEER | $95,000 | BOISE, ID | 2018-03-07 |
| I-200-18051-664417 | Certified | ENGINEER YE NAND | $94,111 | BOISE, ID | 2018-03-02 |
| I-200-18039-730073 | Certified | ENGINEER - PHOTOLITHOGRAPHY | $85,973 | BOISE, ID | 2018-02-22 |
| I-200-18037-102366 | Certified | ENGINEER - CMP - NVM | $99,250 | BOISE, ID | 2018-02-21 |
| I-200-18036-722135 | Certified | ENGINEER - DRY ETCH - NVM | $98,250 | BOISE, ID | 2018-02-20 |
| I-200-18031-706021 | Certified | ENGINEER - EFA | $93,250 | BOISE, ID | 2018-02-07 |
| I-200-17299-452814 | Certified | SCIENTIFIC ENGINEER - CMP PROCESS | $95,000 | BOISE, ID | 2017-11-15 |
| I-200-17304-275073 | Certified | MDE CMP PROCESS ENGINEER | $78,848 | BOISE, ID | 2017-11-07 |
| I-200-17258-108300 | Certified | R&D PHOTOLITHOGRAPHY PROCESS DEVELOPMENT ENGINEER | $96,077 | BOISE, ID | 2017-09-25 |
| I-200-17235-234817 | Certified | R&D WET PROCESS DEVELOPMENT ENGINEER | $102,000 | BOISE, ID | 2017-08-29 |
| I-200-17223-875817 | Certified | PHOTOLITHOGRAPHY PROCESS ENGINEER | $91,667 | MANASSAS, VA | 2017-08-18 |
| I-200-17171-521923 | Certified | DEVICE CHARACTERIZATION ENGINEER | $89,352 | BOISE, ID | 2017-07-13 |
| I-200-17171-890929 | Certified | R&D THIN FILMS PROCESS DEVELOPMENT ENGINEER | $105,868 | BOISE, ID | 2017-06-27 |
| I-200-17158-611564 | Certified | ENGINEER - DRY ETCH - NVM | $93,000 | BOISE, ID | 2017-06-14 |
| I-200-17142-040802 | Certified | CVD PROCESS ENGINEER | $108,000 | MANASSAS, VA | 2017-06-01 |
| I-200-17072-437840 | Certified | ENGINEER - METALS PROCESS | $87,000 | BOISE, ID | 2017-03-20 |
| I-200-17044-381819 | Certified | NAND THIN FILM PROCESS DEVELOPMENT ENGINEER | $93,000 | BOISE, ID | 2017-03-17 |
| I-200-17067-718337 | Certified | ENGINEER-CMP-NVM | $94,000 | BOISE, ID | 2017-03-15 |
| I-200-17061-712945 | Certified | ENGINEER - CMP - NVM | $93,000 | BOISE, ID | 2017-03-14 |
| I-200-17062-098559 | Certified | ENGINEER - DRY ETCH PROCESS | $79,000 | BOISE, ID | 2017-03-14 |
| I-200-17059-560589 | Certified | ENGINEER-CMP-NVM | $93,000 | BOISE, ID | 2017-03-10 |
| I-200-17062-658030 | Certified | ENGINEER-PROCESS-PWF | $93,000 | BOISE, ID | 2017-03-10 |
| I-200-17054-144598 | Certified | ENGINEER - CMP - NVM | $93,000 | BOISE, ID | 2017-03-08 |
| I-200-17037-151806 | Certified | ENGINEER - PHOTOLITHOGRAPHY | $82,500 | BOISE, ID | 2017-03-01 |
| I-200-17044-716294 | Certified | ENGINEER - DRY ETCH - NVM | $94,000 | BOISE, ID | 2017-02-28 |
| I-200-17052-052304 | Certified | ENGINEER YE NAND | $90,611 | BOISE, ID | 2017-02-28 |
| I-200-17025-220972 | Certified | SENIOR ENGINEER-WET PROCESS-DRAM/EMERGING MEMORY | $113,999 | BOISE, ID | 2017-02-24 |
| I-200-17025-294982 | Certified | SMTS - NEW MEMORY DEVELOPMENT | $150,000 | BOISE, ID | 2017-02-24 |
| I-200-17024-034048 | Certified | PVD PROCESS DEVELOPMENT ENGINEER | $93,099 | BOISE, ID | 2017-02-24 |
| I-200-17025-649321 | Certified | ENGINEER-DRAM PROCESS INTEGRATION | $69,500 | BOISE, ID | 2017-02-24 |
| I-200-17028-265477 | Certified | PROCESS INTEGRATION ENGINEER | $94,555 | BOISE, ID | 2017-02-24 |
| I-200-17037-008803 | Certified | ENGINEER-PCVD METALS/DRAM/EM | $89,140 | BOISE, ID | 2017-02-24 |
| I-200-17037-139018 | Certified | SENIOR ENGINEER - PACKAGE INTEGRATION | $94,400 | BOISE, ID | 2017-02-24 |
| I-200-17032-269171 | Certified | SENIOR ENGINEER OF DRAM DEVICE INTEGRATION | $102,077 | BOISE, ID | 2017-02-24 |
| I-200-17039-469537 | Certified | R&D THIN FILMS PROCESS DEVELOPMENT ENGINEER | $103,000 | BOISE, ID | 2017-02-23 |
| I-200-17027-948689 | Certified | DRY ETCH PROCESS DEVELOPMENT ENGINEER | $94,443 | BOISE, ID | 2017-02-22 |
| I-200-17034-675904 | Certified | ENGINEER - DRY ETCH - NVM | $93,000 | BOISE, ID | 2017-02-22 |
| I-200-17030-305895 | Certified | SENIOR ENGINEER - TECHNOLOGY DEVELOPMENT | $118,000 | BOISE, ID | 2017-02-07 |
| I-200-17009-292079 | Certified | ENGINEER-CMP-NVM | $93,000 | BOISE, ID | 2017-01-17 |
| I-200-16341-931985 | Certified | NAND PROCESS INTEGRATION MODULE OWNER | $98,178 | MANASSAS, VA | 2016-12-12 |
| I-200-16315-864708 | Certified | FAB 4 SENIOR CMP PROCESS DEVELOPMENT ENGINEER | $105,567 | BOISE, ID | 2016-11-28 |
| I-200-16322-556080 | Certified | NAND PROCESS INTEGRATION MODULE OWNER | $95,222 | MANASSAS, VA | 2016-11-25 |
| I-200-16288-070761 | Certified | TCAD DEVICE ENGINEER | $118,800 | BOISE, ID | 2016-11-01 |
| I-200-16280-252007 | Certified | DRY ETCH PROCESS DEVELOPMENT ENGINEER | $105,000 | BOISE, ID | 2016-10-14 |
| I-200-16210-569194 | Certified | SENIOR PROCESS ENGINEER | $98,237 | MANASSAS, VA | 2016-08-05 |
| I-200-16168-500885 | Certified | DRY ETCH PROCESS DEVELOPMENT ENGINEER | $87,000 | BOISE, ID | 2016-07-23 |
| I-200-16148-797681 | Certified | DRY ETCH PROCESS OWNER LEVEL 1 | $90,869 | MANASSAS, VA | 2016-06-07 |
| I-200-16113-556209 | Certified | LEAD CMP DEVELOPMENT ENGINEER | $123,350 | BOISE, ID | 2016-05-23 |
| I-200-15176-310428 | Certified | PHOTOLITHOGRAPHY PROCESS ENGINEER | $100,350 | MANASSAS, VA | 2016-05-20 |