Materials Engineers at Micron Technology, Inc. — H1B Salary Data — Page 4
Recent H1B Filings: Materials Engineers at Micron Technology, Inc. — Page 4
The following table shows recent labor condition applications filed by Micron Technology, Inc. for Materials Engineers positions. There are 338 filings total.
| Case # | Status | Job Title | Salary | Location | Date |
|---|---|---|---|---|---|
| I-200-16113-629475 | Certified | PHOTOLITHOGRAHY ENGINEER | $77,464 | MANASSAS, VA | 2016-05-06 |
| I-200-16081-048589 | Certified | ENGINEER - CMP-NVM | $91,729 | BOISE, ID | 2016-03-30 |
| I-200-16081-680577 | Certified | ENGINEER - DRY ETCH DRAM/EM | $93,800 | BOISE, ID | 2016-03-30 |
| I-200-16071-763005 | Certified | ENGINEER - DRY ETCH DRAM/EM | $93,000 | BOISE, ID | 2016-03-21 |
| I-200-15317-228338 | Certified | DEVICE ENGINEER | $102,078 | BOISE, ID | 2016-03-16 |
| I-200-16063-866955 | Certified | SENIOR PROCESS DEVELOPMENT ENGINEER | $103,000 | BOISE, ID | 2016-03-16 |
| I-200-16067-849668 | Certified | R&D WET PROCESS DEVELOPMENT ENGINEER | $122,216 | BOISE, ID | 2016-03-16 |
| I-200-16056-601114 | Certified | THIN FILM PROCESS DEVELOPMENT ENGINEER | $93,000 | BOISE, ID | 2016-03-14 |
| I-200-16054-418185 | Certified | R&D THIN FILMS PROCESS DEVELOPMENT ENGINEER | $103,000 | BOISE, ID | 2016-03-09 |
| I-200-16055-192434 | Certified | DRY ETCH PROCESS DEVELOPMENT ENGINEER | $92,000 | BOISE, ID | 2016-03-09 |
| I-200-16060-397339 | Certified | R&D RETICLE ENGINEER | $90,000 | BOISE, ID | 2016-03-09 |
| I-200-16060-551204 | Certified | DRY ETCH PROCESS OWNER LEVEL 1 | $107,800 | MANASSAS, VA | 2016-03-09 |
| I-200-16061-400639 | Certified | DRY ETCH PROCESS DEVELOPMENT ENGINEER | $92,000 | BOISE, ID | 2016-03-09 |
| I-200-16061-508286 | Certified | PROCESS ENGINEER | $95,000 | BOISE, ID | 2016-03-09 |
| I-200-16014-950606 | Certified | PROCESS INTEGRATION ENGINEER | $91,500 | BOISE, ID | 2016-03-07 |
| I-200-16053-282116 | Certified | PVD PROCESS DEVELOPMENT ENGINEER | $89,800 | BOISE, ID | 2016-03-03 |
| I-200-16053-363312 | Certified | PHOTO PROCESS DEVELOPMENT ENGINEER | $95,200 | BOISE, ID | 2016-03-03 |
| I-200-16047-006231 | Certified | ENGINEER-CMP-DRAM/EM | $92,000 | BOISE, ID | 2016-03-02 |
| I-200-16048-262321 | Certified | CMP PROCESS ENGINEER | $75,385 | BOISE, ID | 2016-02-24 |
| I-200-16049-987937 | Certified | DRY ETCH PROCESS ENGINEER | $91,350 | BOISE, ID | 2016-02-24 |
| I-200-15365-482995 | Certified | R&D THIN FILMS PROCESS DEVELOPMENT ENGINEER | $95,000 | BOISE, ID | 2016-02-23 |
| I-200-16004-271806 | Certified | ENGINEER - PHOTOLITHOGRAPHY | $80,000 | BOISE, ID | 2016-02-23 |
| I-200-16039-469354 | Certified | ENGINEER-PCVD METALS - DRAM/EM | $95,000 | BOISE, ID | 2016-02-18 |
| I-200-15084-333150 | Certified | THIN FILMS PROCESS DEVELOPMENT ENGINEER | $91,380 | BOISE, ID | 2016-02-09 |
| I-200-15313-040591 | Certified | ENGINEER-CELL TECHNOLOGY/R&D | $91,000 | BOISE, ID | 2016-02-09 |
| I-200-15315-935366 | Certified | PACKAGE SIMULATION ENGINEER | $93,000 | BOISE, ID | 2016-02-09 |
| I-200-15316-419703 | Certified | ENGINEER-CMP-NVM/R&D | $92,000 | BOISE, ID | 2016-02-09 |
| I-200-16028-590490 | Certified | ENGINEER - CMP PROCESS | $75,000 | BOISE, ID | 2016-02-09 |
| I-200-16032-879802 | Certified | ENGINEER - YE NAND | $90,000 | BOISE, ID | 2016-02-09 |
| I-200-15348-233894 | Certified | R&D THIN FILMS PROCESS DEVELOPMENT ENGINEER | $92,700 | BOISE, ID | 2015-12-29 |
| I-200-15348-717692 | Certified | PACKAGING INTEGRATION ENGINEER | $88,500 | BOISE, ID | 2015-12-24 |
| I-200-15328-116881 | Certified | SCIENTIFIC ENGINEER - CMP PROCESS | $95,000 | BOISE, ID | 2015-12-01 |
| I-200-15111-096881 | Certified | PHOTOLITHOGRAPHY PROCESS ENGINEER | $106,763 | MANASSAS, VA | 2015-11-19 |
| I-200-15278-515436 | Certified | SEMICONDUCTOR PROCESS ENGINEER MANAGER | $105,000 | BOISE, ID | 2015-10-15 |
| I-200-15055-890618 | Certified | PVD PROCESS DEVELOPMENT ENGINEER | $89,800 | BOISE, ID | 2015-10-14 |
| I-200-15062-150678 | Certified | DRY ETCH PROCESS OWNER | $107,800 | MANASSAS, VA | 2015-10-14 |
| I-200-15026-358851 | Certified | PHOTO PROCESS DEVELOPMENT ENGINEER | $95,200 | BOISE, ID | 2015-10-09 |
| I-200-15258-587813 | Certified | ENGINEER-CMP-NVM/PROCESS R&D | N/A | BOISE, ID | 2015-09-22 |
| I-200-15252-667826 | Certified | ENGINEER - PROCESS | N/A | BOISE, ID | 2015-09-17 |
| I-200-15252-991687 | Certified | SR ENGINEER - PROCESS | N/A | BOISE, ID | 2015-09-17 |
| I-200-15025-490477 | Certified | RDA MODULE ENGINEER | N/A | MANASSAS, VA | 2015-07-28 |
| I-200-15190-583902 | Certified | ENGINEER DRAM - PI | N/A | BOISE, ID | 2015-07-15 |
| I-200-15061-374339 | Certified | CVD SHIFT ENGINEER | N/A | MANASSAS, VA | 2015-07-13 |
| I-200-15176-690725 | Certified | RDA EXCURSION CONTROL ENGINEER | N/A | MANASSAS, VA | 2015-07-07 |
| I-200-15176-823662 | Certified | DIFFUSION PROCESS OWNER | N/A | MANASSAS, VA | 2015-07-07 |
| I-200-15103-638092 | Certified | PROCESS INTEGRATION ENGINEER-PCM | N/A | BOISE, ID | 2015-06-24 |
| I-200-15159-169641 | Certified | PHOTOLITHOGRAPHY PROCESS DEVELOPMENT ENGINEER | N/A | BOISE, ID | 2015-06-17 |
| I-200-15092-721612 | Certified | RDA ENGINEER | N/A | BOISE, ID | 2015-06-08 |
| I-200-15135-853634 | Certified | ADVANCED PACKAGING R&D DIE STACKING AND DIE ATTACH ENGINEER | N/A | BOISE, ID | 2015-05-26 |
| I-200-15139-389855 | Certified | ENGINEER-R&D MATERIALS | N/A | BOISE, ID | 2015-05-26 |